BGA is an abbreviation for Ball Grid Array and refers to a surface mount package for IC circuits. Electronics such as microprocessors can be permanently mounted on circuit boards with BGA holes through the manufacturer. This packaging method has the advantage that compared with DIP assembly, BAG can have more interconnection pins and each pin has a solder ball. All connections are distributed in a uniform surface grid or matrix across the components. Therefore, electronics manufacturers have a soft spot for manufacturing BGA PCB boards, and we will introduce it in more detail next:

FS Technology is a company with strong pcb component procurement capabilities. Our understanding of PCB components is the strongest in China. In order to demonstrate our capabilities in this area, we have prepared some component-related knowledge:

With the arrival of summer, the frequency of use of air conditioners is getting higher and higher, followed by the maintenance of air conditioners. According to statistics, 70% of air conditioners are damaged due to pcb boards. This article will explain the maintenance precautions of FS Technology's air conditioner circuit boards.

Summary: As we all know, in winter and summer, air conditioners generally need heating and cooling almost every day, so long-term use will inevitably cause some minor problems. Many failures are caused by damaged air conditioner PCBs. So, what are the maintenance methods for common faults of air conditioner PCB? What are the precautions for air conditioning circuit board maintenance?